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| STPS10L60C Power Schottky rectifier Main product characteristics A1 IF(AV) VRRM Tj (max) VF (max) 2x5A A2 K 60 V 150 C 0.52 V K Features and benefits A2 Low forward voltage drop Negligible switching losses Insulated package: TO-220FPAB Insulating voltage = 2000 V DC Capacitance = 12 pF Avalanche capability specified K A1 A2 A1 TO-220FPAB STPS10L60CFP D2PAK STPS10L60CG Description Dual center tap Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters. Packaged in TO-220FPAB and D2PAK, this device is intended for use in high frequency inverters. March 2007 Rev 4 1/8 www.st.com 8 Characteristics STPS10L60C 1 Characteristics Symbol VRRM IF(RMS) IF(AV) IFSM IRRM PARM Tstg Tj dV/dt 1. dPtot --------------dTj Parameter Repetitive peak reverse voltage RMS forward current Average forward current TO220FPAB TC = 130 C = 0.5 Per diode Per device Value 60 30 5 10 180 1 4000 -65 to + 175 150 10000 Unit V A A A A W C C V/s Surge non repetitive forward current Repetitive peak reverse current Repetitive peak avalanche power Storage temperature range tp = 10 ms Sinusoidal tp = 2 s square F=1 kHz tp = 1 s Tj = 25 C Maximum operating junction temperature(1) Critical rate of rise reverse voltage < 1 ------------------------Rth ( j - a ) thermal runaway condition for a diode on its own heatsink Table 1. Symbol Rth (j-c) Rth (c) Thermal resistance Parameter Junction to case TO-220FPAB Per diode Total Coupling Value 4.5 3.5 2.5 Unit C/W C/W When the diodes 1 and 2 are used simultaneously : Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) Table 2. Symbol IR (1) Static electrical characteristics (per diode) Parameter Reverse leakage current Tests Conditions Tj = 25 C Tj = 125 C Tj = 25 C IF = 5 A IF = 5 A IF = 10 A IF = 10 A 0.55 0.43 VR = VRRM Min. Typ. Max. 220 45 60 0.55 0.52 V 0.67 0.64 Unit A mA VF (1) Forward voltage drop Tj = 125 C Tj = 25 C Tj = 125 C 1. Pulse test : tp = 380 s, < 2% To evaluate the conduction losses use the following equation: P = 0.44 x IF(AV) + 0.0091x IF2(RMS) 2/8 STPS10L60C Characteristics Figure 1. Average forward power dissipation Figure 2. versus average forward current (per diode) IF(AV)(A) = 0.05 = 0.1 = 0.2 6 Average forward current versus ambient temperature ( = 0.5) (per diode) PF(AV)(W) 3.5 3.0 2.5 = 0.5 5 Rth(j-a)=Rth(j-c) =1 2.0 4 Rth(j-a)=15C/W 3 1.5 2 1.0 0.5 T T 1 IF(AV)(A) 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 =tp/T 5.0 5.5 tp =tp/T 0 6.5 tp Tamb(C) 50 75 100 125 150 6.0 0 25 Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Normalized avalanche power derating versus junction temperature PARM(tp) PARM(1s) 1 1.2 1 0.1 0.8 0.6 0.4 0.2 0.001 0.01 0.1 1 PARM(tp) PARM(25C) 0.01 tp(s) 10 100 1000 Tj(C) 0 25 50 75 100 125 150 Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values, per diode) (TO-220FPAB) Figure 6. Relative variation of thermal transient impedance junction to case versus pulse duration (TO-220FPAB) IM(A) 90 80 70 60 Zth(j-c)/Rth(j-c) 1.0 0.8 0.6 50 40 30 20 10 0 1E-3 TC=125C IM t TC=25C TC=75C = 0.5 0.4 = 0.2 0.2 = 0.1 T =0.5 t(s) 0.0 1E-2 1E-1 1E+0 Single pulse tp(s) 1E-2 1E-1 =tp/T 1E+0 tp 1E-3 1E+1 3/8 Characteristics STPS10L60C Figure 7. Relative variation of thermal transient impedance junction to case versus pulse duration (D2PAK) Figure 8. Reverse leakage current versus reverse voltage applied (typical values, per diode) Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-03 1.E-02 1.E-01 1.E+00 Single pulse IR(mA) 3E+2 1E+2 Tj=150C Tj=125C 1E+1 Tj=100C Tj=75C 1E+0 Tj=50C 1E-1 Tj=25C 1E-2 tp(s) 1E-3 0 5 10 15 20 25 VR(V) 30 35 40 45 50 55 60 Figure 9. Junction capacitance versus reverse voltage applied (typical values, per diode) Figure 10. Forward voltage drop versus forward current (maximum values, per diode) IFM(A) 100.0 C(pF) 1000 F=1MHz VOSC=30mVRMS Tj=25C Tj=150C (typical values) Tj=25C 500 Tj=125C 10.0 200 1.0 VR(V) 100 1 10 100 0.1 0.0 0.2 0.4 0.6 0.8 1.0 VFM(V) 1.2 1.4 1.6 1.8 2.0 2.2 2.4 Figure 11. Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness: 35 m) ( D2PAK) Rth(j-a)(C/W) 80 70 60 50 40 30 20 10 0 0 5 10 15 20 25 30 35 40 S(Cu)(cm) 4/8 STPS10L60C Package information 2 Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.55 Nm Maximum torque value: 0.70 Nm TO-220FPAB dimensions Dimensions REF. Millimeters Min. A H2 Dia L5 L7 L6 C A Table 3. Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.045 0.195 0.094 0.393 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.067 0.205 0.106 0.409 Max. 4.60 2.70 2.75 0.70 1.00 1.70 1.70 5.20 2.70 10.40 4.40 2.50 2.50 0.45 0.75 1.15 1.15 4.95 2.40 10.00 B D E F F1 L2 F2 F1 L9 L4 F G1 G M E D F2 G G1 H L2 L3 L4 L5 L6 L7 Diam 16.00 Typ. 28.60 9.80 2.9 15.90 9.00 3.00 30.60 10.60 3.6 16.40 9.30 3.20 0.630 Typ. 1.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126 5/8 Package information Table 4. D2PAK dimensions STPS10L60C Dimensions Ref Millimeters Min. A A E L2 Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 Max. 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 A1 C2 A2 B D L L3 A1 B2 B G A2 B2 C C2 C R D E G L M * V2 L2 L3 M R V2 * FLAT ZONE NO LESS THAN 2mm 0.40 typ. 0 8 0.016 typ. 0 8 Figure 12. Footprint (dimensions in millimeters) 16.90 10.30 1.30 5.08 8.90 3.70 In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 6/8 STPS10L60C Ordering information 3 Ordering information Delivery mode Tube Tube Tape and reel Type STPS10L60CFP STPS10L60CG STPS10L60CG-TR Marking STPS10L60CFP STPS10L60CG STPS10L60CG Package TO-220FPAB D PAK D PAK 2 2 Weight 2g 1.48 g 1.48 g Base qty 50 50 1000 4 Revision history Date Jul-2003 26-Mar-2007 Revision 3C 4 Last release. Removed ISOWATT package. Added D2PAK package. Description of Changes 7/8 STPS10L60C Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 |
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